6/8/10/12 inch wafer uv debonding machine
scanned wafer film degumming machine- Wave365/385/395/405nm(Customised)
- Applicationsuv film debonding
- Wafer size4/6/8/10/12 inch
- Nitrogen fillingOptional
- Light intensity10-10000mW/cm²
Related product literature downloads
Brief description of the UV debonding machine
A UV debonding machine is a specialized device designed for the controlled and precise debonding or separation of materials using ultraviolet light technology. This equipment is commonly used in industries where the delamination of materials, removal of adhesives, or separation of bonded components is required. Here are key features and functionalities associated with a UV debonding machine:
1. Ultraviolet Light Source: The core of the UV debonding machine is its ultraviolet light source. This source emits UV light with specific wavelengths suitable for breaking down or weakening the bonds between materials, such as adhesives or bonding agents.
2. Controlled Exposure: The machine allows for controlled exposure of the materials to UV light. This precision is crucial to target specific areas or interfaces where debonding is required, minimizing the impact on surrounding materials.
3. Application in Various Industries: UV debonding machines find applications in industries such as electronics, aerospace, and medical devices. They are used for tasks like removing adhesives from electronic components, delaminating composite materials, or separating bonded medical devices.
4. Customizable Settings: Many UV debonding machines come with customizable settings, allowing operators to adjust parameters such as UV intensity, exposure time, and wavelength. This flexibility ensures adaptability to different materials and bonding scenarios.
5. Real-Time Monitoring: Some advanced systems incorporate real-time monitoring features. This allows operators to observe the debonding process, ensuring that it meets the desired specifications and avoiding damage to sensitive components.
6. Safety Features: UV debonding machines are equipped with safety features to protect operators from exposure to UV light. This may include interlocks, shielding, and other safety mechanisms.
7. Environmentally Friendly: Compared to traditional methods of debonding or adhesive removal, UV debonding is often considered more environmentally friendly. It minimizes the use of harsh chemicals and reduces waste.
8. Increased Efficiency: The controlled and targeted nature of UV debonding contributes to increased efficiency in material separation processes. It can result in faster processing times and reduced damage to underlying substrates.
It’s important to note that specific features and functionalities may vary among different UV debonding machines, and advancements in technology may introduce new capabilities. For the most accurate and up-to-date information, it’s recommended to consult with manufacturers or suppliers of UV debonding equipment.
Product Applications
Futansi UV LED debonding machine is a UV cutting film tape surface curing, so as to complete the automatic debonding of wafer chips light source curing equipment, is a cold light source LED UV debonding curing lamp. UV debonding machine in the wafer packaging industry is widely used, such as ceramic cutting, glass processing and other processes can be used in the UV debonding process, but also some optical lenses, LED integrated chips, circuit boards and other semiconductor Materials UV debonding can also be used.
led uv light source application areas are wide, suitable for ink printing, industrial products fixed, specific applications can be referred to the following:
1、optical communication industry
active devices, passive device packaging, optical fiber optical cable coating curing bonding;
2、photovoltaic new energy
photovoltaic chips, lithium battery module curing;
3、semiconductor materials
wafer chips, uv film debonding;
4、medical devices
medical catheters, syringes, endoscopes, infusion tubes and other medical devices sealing;
5、3C electronics
mobile phone parts, digital camera accessories, motor components, semiconductor chips, sensors, encoders, etc.;
6、PCB circuit board
electronic components fixed, core circuit potting, chip protection, antioxidant coating protection;
7、optical parts
lens modules, optical lenses, infrared night vision assembly bonding;
8、liquid crystal display
surface edge encapsulation.
9、laboratory materials
polymer chemistry, semiconductor materials light curing;
10、ink printing
screen printing label printing.
Product Advantages
1、Imported LED lamp beads
Advantages such as high energy, strong light and long service life;
2、Single-band LED ultraviolet light source
common wavelengths of 365nm, 385nm, 395nm, 405nm, no thermal radiation;
3, UVLED curing light source without heat radiation
UV degumming machine using high power LED lamp beads, emitting 365/385/395/405nm single-band UV light source, no infrared wavelength, the irradiated substrate surface temperature rise of no more than 5 ℃, no thermal radiation damage to the substrate surface, suitable for heat-sensitive material surface drying;
4、Multi-channel working mode
UV de-bonding machine standard with a UVLED light source equipment, according to the actual use of the situation, choose 1-4 irradiation head alone or synchronous work, no need to repeat the purchase of light source equipment, effective cost savings;
5、Low power consumption
Through the led chip for electrical energy & mdash; & mdash; light energy conversion, less energy loss, low power consumption, about one tenth of the traditional UV mercury lamp, can save a lot of electricity consumption each year;
6、Clean and environmental protection without pollution
Does not contain mercury metal harmful substances, does not produce ozone when used, belongs to a clean and environmentally friendly energy;
7, small size, small footprint
UVLED curing machine covers an area far less than the traditional UV mercury lamp lamp, can be customized shape size and irradiation area, the average size of about 1/10 of the UV lamp type, light weight, small physical strength, suitable for use in different working environments;;
8、Long service life
UVLED emits ultraviolet light source through LED lamp beads, its use time is more than 20,000h on average, compared to the traditional UV mercury lamp service life (average use time is about 800h) is much longer, can instantly light up/off led ultraviolet light source, not affected by switch closure;
NO. | Parts | Items | Technique Data |
1 | Controller UVSF81T | Voltage | 220V |
2 | MODEL SIZE | Please refer to the figure below | |
3 | Cooling mode | Air-Cooled | |
4 | Control Method | On-screen touch/pedal /RS232/485 communication | |
5 | Adjustable range of irradiationpower | 10%-100% adjustable | |
6 | irradiation swelling model | Manual: Steady on after startup | |
7 | Automatic: Set irradiation countdown time (0.1-999.9s) | ||
8 | Step: Achieve step irradiation (1-20 steps) | ||
9 | Loop ladder: single/infinite | ||
10 | traffic control | RS232 serial port, 485: data read and write, LED switchand parameter control | |
11 | I\O interface LED switch control and running stateoutput | ||
12 | Irradiation head UVSF81T(350350) | heat-dissipating method | air cooling |
13 | wavelength coverage | 365±5nm | |
14 | External structural dimension | Please refer to the figure below | |
15 | Light point size | Please refer to the figure below | |
16 | Suggested range | 15-20 (mm) | |
17 | exposure intensity (MAX) | 600 mw/c ㎡(FTIU500 Illuminometer measurement data) | |
18 | Uniformity of irradiation intensity | 10%, homogeneity=( (Max-Min)/(Max +Min)×100% ) | |
19 | working life | 20000 hour (Constant temperature 20±1℃, constanthumidity 50±3%, attenuation about 25%) | |
20 | Manual UV nitrogen filling and gluing machine(UVJM82T) | External structural dimension | Please refer to the figure below |
21 | Product placement size | Please refer to the figure below | |
22 | power cord | cable | 2m |
23 | connecting line | cable | 2m |
24 | Optional functions | on-line monitoring | No |
25 | Optional functions | Radiosity | No |
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